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R163-S32 (rev. AAC2)


Rack Server - 4th/5th Gen Intel® Xeon® Scalable - 1U UP 12-Bay Gen4 NVMe/SATA/SAS
  • 4th/5th Gen Intel® Xeon® Scalable Processors

  • Intel® Xeon® CPU Max Series

  • Single processor, LGA 4677

  • 8-Channel RDIMM DDR5 per processor, 16 x DIMMs

  • Dual ROM Architecture

  • 1 x 1Gb/s LAN port via Intel® I210-AT

  • 1 x Dedicated management port

  • 4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

  • 8 x 2.5" SATA/SAS hot-swappable bays

  • 1 x M.2 slot with PCIe Gen3 x4 interface

  • 2 x FHHL PCIe Gen5 x16 slots

  • 2 x OCP 3.0 Gen5 x16 slots

  • 1+1 1300W 80 PLUS Platinum redundant power supplies

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详情介绍
Dimensions (WxHxD, mm)
1U

438 x 43.5 x 710


Motherboard

MS33-DC0


CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

Single processor, TDP up to 350W


Socket
1 x LGA 4677

Socket E


Chipset

Intel® C741 Chipset


Memory
16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
5th Gen Intel® Xeon®: Up to *5600MT/s (1DPC), 4400MT/s (2DPC)
4th Gen Intel® Xeon®: Up to 4800MT/s (1DPC), 4400MT/s (2DPC)
Intel® Xeon® Max Series: Up to 4800MT/s (1DPC), 4400MT/s (2DPC)

*5600MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.


LAN
Rear side:
1 x 1Gb/s LAN port (1 x Intel® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN


Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface

1920x1200@60Hz 32bpp


Storage
Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x 2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support


SAS

Depends on SAS add-in card


RAID

Intel® SATA RAID 0/1/10/5


Expansion Slots
Riser Card CRS101O:
- 1 x PCIe x16 (Gen5 x16) FHHL slot
Riser Card CRS101P:
- 1 x PCIe x16 (Gen5 x16) FHHL slot
2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH

- Supports 2280/22110 cards


Internal I/O
1 x TPM header

1 x VROC connector


Front I/O
1 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x Storage activity LED

1 x System status LED


Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN

1 x ID button with LED


Backplane Board
Speed and bandwidth:

PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s


TPM
1 x TPM header with SPI interface

Optional TPM2.0 kit: CTM010


Power Supply
1+1 1300W 80 PLUS Platinum redundant power supplies
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12V/ 105.4A
+12Vsb/ 3A

Note: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.


System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
  • Dashboard

  • HTML5 KVM

  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)

  • Sensor Reading History Data

  • FRU Information

  • SEL Log in Linear Storage / Circular Storage Policy

  • Hardware Inventory

  • Fan Profile

  • System Firewall

  • Power Consumption

  • Power Control

  • Advanced power capping

  • LDAP / AD / RADIUS Support

  • Backup & Restore Configuration

  • Remote BIOS/BMC/CPLD Update

  • Event Log Filter

  • User Management

  • Media Redirection Settings

  • PAM Order Settings

  • SSL Settings

  • SMTP Settings


OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:

Windows Server 2022


System Fans
4 x 40x40x56mm (29,700rpm)

2 x 40x40x28mm (25,000rpm)


Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)


Weight
Net Weight: 18.39 kg

Gross Weight: 20.39 kg


Packaging Dimensions

977 x 588 x 236 mm


Packaging Content
1 x R163-S32
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
3 x Carrier clips

1 x 2-Section Rail kit


Part Numbers
- Barebone package (4th/5th Gen): 6NR163S32DR000ABC2*
- Barebone package (4th Gen): 6NR163S32DR000AAC2*
- Motherboard: 9MS33DC0UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1030: 9CFP1030NR-00
- Backplane board - CBP10C0: 9CBP10C0NR-00
- Fan module: 25ST2-405623-A0R/25ST2-442828-D0R
- Riser card - CRS101O: 9CRS101ONR-00
- Riser card - CRS101P: 9CRS101PNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-213006-F3S

Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R

* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有*不相符之处,应以实际产品为准。创捷数字保留在*时间做出修改之权利。对*因使用上述数据而引致之损失,创捷数字概不承担*责任。

* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的*理论值,实际效能可能因规格及设备而有所不同。

* 本文中所使用之各项商标及企业识别图示,均为其合法*人之财产。

* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

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