R143-EG0 (rev. AAC2)

Rack Server - AMD EPYC™ 8004 - 1U UP 1 x PCIe Gen5 GPU (NVMe/SATA/SAS)

Supports 1 x Dual slot Gen5 GPU
Single AMD EPYC™ 8004 Series Processors
6-Channel RDIMM DDR5, 12 x DIMMs
Dual ROM Architecture
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
1 x M.2 slot with PCIe Gen3 x4 interface
1 x FHFL PCIe Gen5 x16 slot for GPUs
1 x FHFL PCIe Gen5 x16 slot
1 x FHHL PCIe Gen5 x16 slot
1 x OCP 3.0 Gen5 x16 slot
1+1 1300W 80 PLUS Platinum redundant power supplies

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详情介绍

Dimensions (WxHxD, mm)

438 x 43.5 x 815

Motherboard

MEG3-GU0

CPU

AMD EPYC™ 8004 Series Processors
Single processor, 5nm technology
Up to 64 cores, 128 threads

cTDP up to 225W

Socket

1 x LGA 4844

Socket SP6

Chipset

System on Chip

Memory

12 x DIMM slots
DDR5 memory supported only
6-Channel memory architecture
RDIMM up to 96GB supported

Memory speed: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)

LAN

Rear side:

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface

1920x1200@60Hz 32bpp

Storage

Front side:
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS* hot-swappable bays

*SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

Expansion Slots

PCIe Cable x 3:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, for GPUs
- 1 x PCIe x16 (Gen5 x16) FHFL slot, occupied when Dual slot GPU is installed
- 1 x PCIe x16 (Gen5 x16) FHHL slot
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function
1 x M.2 slot:
- M-key
- PCIe Gen3 x4

- Supports 2280/22110 cards

Internal I/O

1 x TPM header

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs (disabled)
1 x Storage activity LED

1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
1 x MLAN

1 x ID button with LED

Backplane Board

Speed and bandwidth:

PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

- Optional TPM2.0 kit: CTM010

Power Supply

1+1 1300W 80 PLUS Platinum redundant power supplies
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+12V/ 105.4A

+12Vsb/ 3A

System Management

Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

8 x 40x40x56mm (29,700rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1038 x 588 x 238 mm

Packaging Content

1 x R143-EG0-AAC2
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (12VHPWR to 12VHPWR, 450mm)

1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR143EG0DR000AAC2*
- Motherboard: 9MEG3GU0UR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0206-K0R
- CPU heatsink: 25ST1-44320G-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front board - CFP1010: 9CFP1010NR-00
- Backplane board - CBP1047: 9CBP1047NR-00
- Fan module: 25ST2-405623-A0R
- I/O board - CBG70: 9CBG70NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (12VHPWR, 450mm): 25CRI-450101-Y4R
- Power supply: 25EP0-21300B-F3S

Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有*不相符之处，应以实际产品为准。创捷数字保留在*时间做出修改之权利。对*因使用上述数据而引致之损失，创捷数字概不承担*责任。

* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的*理论值，实际效能可能因规格及设备而有所不同。

* 本文中所使用之各项商标及企业识别图示，均为其合法*人之财产。

* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。