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R282-G30 (rev. 100)


Rack Server - 3rd Gen Intel® Xeon® Scalable - 2U DP 3 x PCIe Gen4 GPUs

  • NVIDIA-Certified System - Data Center Server

  • Supports up to 3 x Dual slot Gen4 GPUs

  • 3rd Gen Intel® Xeon® Scalable Processors

  • Dual processor, LGA 4189

  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs

  • Supports Intel® Optane™ Persistent Memory 200 series

  • Dual ROM Architecture

  • Intel® C621A Chipset

  • 2 x 1Gb/s LAN ports via Intel® I350-AM2

  • 1 x Dedicated management port

  • 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

  • 8 x 3.5"/2.5" SATA/SAS hot-swappable bays

  • 5 x FHFL PCIe Gen4 x16 slots

  • 1 x OCP 3.0 Gen4 x16 slot

  • 1 x OCP 2.0 Gen3 x8 mezzanine slot

  • 1+1 2400W 80 PLUS Platinum redundant power supplies

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详情介绍
Dimensions (WxHxD, mm)
2U

438 x 87.5 x 730


Motherboard

MR92-FS1


CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor, 10nm technology
TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.


Socket
2 x LGA 4189

Socket P+


Chipset

Intel® C621A


Memory
32 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported

1.2V modules: 3200/2933/2666 MT/s


LAN
Rear side:
2 x 1Gb/s LAN ports (Intel® I350-AM2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN


Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface

1920x1200@60Hz 32bpp


Storage
Front side:
4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x 3.5"/2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support


SAS

Depends on SAS add-in cards


RAID

Depends on SAS add-in cards


Expansion Slots
Riser Card CRS2014:
- 1 x PCIe x16 (Gen4 x16) FHFL slot, from CPU_1, for GPUs
Riser Card CRS2026 x 2:
- 2 x PCIe x16 (Gen4 x16) FHFL slots, from CPU_0, for GPUs
- 2 x PCIe x16 (Gen4 x16) FHFL slots, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
Supports NCSI function
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth, from CPU_1

Supports NCSI function


Internal I/O
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper

1 x BIOS recovery jumper


Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x Storage activity LED

2 x LAN activity LEDs


Rear I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN

1 x ID button with LED


Backplane Board
Speed and bandwidth:

PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s


TPM
1 x TPM header with SPI interface

Optional TPM2.0 kit: CTM010


Power Supply
1+1 2400W 80 PLUS Platinum redundant power supplies (-100)
AC Input:
- 100-127V~/ 12.5A, 47-63Hz
- 180-200V~/ 14.5A, 47-63Hz
- 200-240V~/ 14.5A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2200W/ 180-200V~
+12V/ 180A
+12Vsb/ 3A
- Max 2400W/ 200-240V~ or 240Vdc Input
+12V/ 197A
+12Vsb/ 3A
1+1 2700W 80 PLUS Titanium redundant power supplies (-1T0)
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1008W/ 100-127V~
+12V/ 84A
+12Vsb/ 3A
- Max 2700W/ 200-240V~ or 240Vdc Input
+12V/ 225A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.


System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
  • Dashboard

  • HTML5 KVM

  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)

  • Sensor Reading History Data

  • FRU Information

  • SEL Log in Linear Storage / Circular Storage Policy

  • Hardware Inventory

  • Fan Profile

  • System Firewall

  • Power Consumption

  • Power Control

  • Advanced power capping

  • LDAP / AD / RADIUS Support

  • Backup & Restore Configuration

  • Remote BIOS/BMC/CPLD Update

  • Event Log Filter

  • User Management

  • Media Redirection Settings

  • PAM Order Settings

  • SSL Settings

  • SMTP Settings


OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later


System Fans

4 x 80x80x38mm (16,300rpm)


Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)


Packaging Dimensions

982 x 588 x 268 mm


Packaging Content
1 x R282-G30
2 x CPU heatsinks
2 x GPU power cables (CPU 8pin to CPU 8pin, 150mm)
1 x GPU power cable (CPU 8pin to CPU 8pin, 350mm)

1 x 2-Section Rail kit


Part Numbers
- Barebone package: 6NR282G30MR-00-1*
- Motherboard: 9MR92FS1NR-00
- 2-Section Rail kit (CMA not supported): 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-453204-M1R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20C5: 9CBP20C5NR-00
- Fan module: 25ST2-883829-D0R
- Riser card - CRS2014: 9CRS2014NR-00
- Riser card - CRS2026: 9CRS2026NR-00
- GPU power cable (CPU 8pin, 350mm): 25CRI-350100-Y4R
- GPU power cable (CPU 8pin, 600mm): 25CRI-600100-Y4R
- Power supply (-100): 25EP0-224000-D0S
- Power supply (-1T0): 25EP0-227000-D0S

Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- 3-Section Rail kit (Supports CMA): 25HB2-AA6105-K0R
- Cable Management Arm: 25HB1-R18300-K0R
- RMA packaging: 6NR282G30SR-RMA-A100

* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有*不相符之处,应以实际产品为准。创捷数字保留在*时间做出修改之权利。对*因使用上述数据而引致之损失,创捷数字概不承担*责任。

* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的*理论值,实际效能可能因规格及设备而有所不同。

* 本文中所使用之各项商标及企业识别图示,均为其合法*人之财产。

* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

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